Australian National Fabrication Facility

 

 

 

 

 

 

 

 

 

 

 

Facebook Facebook

Laboratory and Equipment Resources

Please find relevant information below regarding Laboratory Safety, Tutorials, WHS documentation such as risk assessments and safe operating procdures WHS Procedures and Standard Process Recipes.

 

Laboratory Safety & Emergency Information

Before accessing the facilities all users must complete the induction webinar and complete the mandatory Laboratory Induction which MUST be completed and signed before access to the laboratory is granted. Please note, there will be an on-site laboratory tour to finish the induction.

It is also vital that all users familiarise themselves with the ANFF Laboratory Emergency Procedures as this document gives general information on the layout of the laboratories and associated facilities. There are also clear procedures on what to do in the event of any alarms being activated.

 

WHS Risk Assessments of Laboratories

The following table contains risk assessments (RA) and after-hours safe working procedures (AH_SWP) for our laboratories. Please familiarize youself and contact our process engineering staff if there are any questions.

Building Lab RA AH_SWP
Huxley 56 H4.30 RA AH SWP
JCSMR 131 131_1.147 RA AH SWP
Weigold 58B W2.04 RA
Weigold 58B W2.05 RA AH SWP
Weigold 58B W2.06 RA AH SWP
Carver 58C J4.24 RA
Carver 58C J4.25 RA
Nuclear 58A A107/A201 RA
#160 P3.51 RA AH SWP

 

Tutorials

Below are the links to tutorials covering nanofabrication techniques supported by our node. It covers introduction, theory and capapbilities of various tools.

Overview of ANFF-ACT Capabilities Fabrication technology webinars

Overview of ANFF-ACT Capabilities

This induction webinar outlines laboratory specific induction and authorisation requirements for the ANFF laboratories located in the Weigold Building (W2.05 and W2.06). It provides information about the inherent risks and controls established for the laboratory. New or modified tasks to be carried out in the laboratory require further formal risk assessment and subsequent approval. In addition, training will be provided for plant, equipment and safe working practices.

Physical Vapor Deposition (PVD)

Chemical Vapor Deposition (CVD)

Electron Beam Lithography (EBL)

Focussed Ion Beam (FIB)

Scanning Electron Microscopy with Cathodoluminescence (SEM-Cl)

 

Equipment Information

The following table contains equipment specific information on risks assessments (RA), safe working procedures (SWP), instruction manuals (IM) or, for reference if required, the equipment manufacturers manuals (e.g. hardware (MH), software (MS) or general equipment manual (MM). Please familiarize youself and contact our process engineering staff if there are any questions.

RA SWP IM MH MS
AFM Nanosurf CoreAFM Mx_Nanosurf_CoreAFM Lily Olivier Kaushal  
Barrel Etcher PVA TePla L9_Tepla_Barrel_Etcher Olivier Kaushal Gayatri IM
Desiccator Canbinet TerraUniversal ValuLine Desiccator L9_N2_desiccator_cabinet tbd
Diamond Sciber OEG MR200 xx_Diamond_Scriber Naiyin RA IM
E-beam Evaporator Temescal BDJ-2000 D4_E-beam_Evap_BJD2000 Lily Kaushal
EBL Elionix Boden 125 EBL1_Elionix Gayatri Lily Kaushal RA IM
EBL Raith 150 EBL2_Raith Gayatri Lily Kaushal IM
EDC Laurell WS1000 Wx_Laurell_WS1000 Olivier Sukanta? Kaushal   MH
Electroplating CHI 600E xx_Electro_Plating Lily Kaushal
Ellipsometer JA Woollam M-2000DI M4_Woollam_Ellipsometer Gayatri Kaushal IM
FIB FEI Helios NanoLab 600 FIB_Helios600 Lily Olivier Kaushal IM
Flipchip Bonder Finetech Fineplacer Lambda CE_Pg3_Flipchip_Finetech Kaushal Horst IM MM MH
Glovebox N2 Scitek Glovebox N2 xx_Glovebox_N2_Scitek Kaushal  
Hot Embosser EVG 520HE L5_Embosser_EVG520 Gayatri Kaushal IM
ICP-Cl Samco 400iP P6_RIE_ICP-CL Naiyin Kaushal IM * *
ICP-F Samco 400iP P5_RIE_ICP-F Naiyin Kaushal IM * *
Mask Aligner Karl SUSS MA6 L2_Karl_SUSS_MA6 Gayatri Kaushal
Mask Aligner EVG 620 L4_NIL_Aligner_EVG620 Gayatri Kaushal IM
Maskless Aligner Heidelberg MLA150 L20_Heidelberg_MLA150 Gayatri Kaushal RA IM
MOCVD 1 Aixtron 3x2FT III-V MOCVD1 Mykhaylo Naiyin Hoe  
MOCVD 2 Aixtron 200/4 MOCVD2 Mykhaylo Naiyin Hoe  
MOCVD 3 Aixtron 3x2FT III-N MOCVD3 Mykhaylo Naiyin Hoe  
Parylene Coater Diener P6 D16_Parylene_Coater Olivier Naiyin Kaushal RA MH MS
PECVD Oxford Instruments PlasmaLab 100 P8_PECVD_Oxford100 Naiyin Kaushal IM
Plasma ALD PicoSun Sunale P7_P-ALD_Picosun Naiyin Kaushal IM
RIE (old) Oxford Instruments Plasma80 P12_RIE_Oxford80 Naiyin Kaushal IM
RTA Qualiflow Therm JetFirst 100 H4_RTA_JetFirst100 Naiyin Kaushal IM
RTA Jipelec JetFirst 100 Hx_RTA_Jipelec Naiyin Kaushal  
SEM-CL FEI Verios 460 SEM SEM-CL_Verios460 Olivier Lily IM
Spin Coater SPS Polos SPIN150x Lxx_SPS_Spin_Coater Gayatri Kaushal  
Sputter AJA Intl. ATC-2400V D3_AJA_Sputter Olivier Kaushal IM
Sputter Denton Desk V SEM_Denton_Sputter Lily IM
Stylus Surface Profiler Bruker Dektak XT M3_Bruker_Surface_Profiler Olivier Kaushal
Thermal ALD Cambridge Nano Tech Savannah P3_T-ALD_Savannah Naiyin Kaushal
Thermal Evaporator Kurk Lesker Nano36 D5_Thermal_Evap_Nano36 Lily Kaushal IM
Ultrasonic Bath Elma Trasnssonic TI-H-15 xx_Elma_Transsonic  
Wetbench 1 MicroVoid CS-41-FRPP-9FT WB01_Spin Gayatri Olivier Kaushal   MH
Wetbench 2 MicroVoid CS-41-SS-6FT WB02_Develop Gayatri Olivier Kaushal   MH
Wetbench 3 MicroVoid CS-41-FRPP-6FT WB03_Acid Olivier Gayatri Kaushal   MH
Wetbench 4 MicroVoid CS-41-FRPP-6FT WB04_Solvent tbd   MH
Wetbench 5 MicroVoid CS-41-SS-6FT WB05_Base tbd   MH
Wire Bonder Westbond 747677E xx_WB_Westbond Olivier Naiyin Kaushal  

 

* Some equipment information contains manufacturers IP and is not publically available. Please contact ANFF staff to gain access to confidential information provided by the manufacturer/vendor.

 

Standard Process Recipes

Here is a list of typical fabricatioin process 'recipes' for a variety of tools. Please do not hesitate to consult our process engineers for advice on variations, to achieve the outcomes you require.

PEVCD

SiO2

Si3N4

a-Si

MOCVD

GaAs
InP
GaN

ICP-Cl

GaAs
InP
GaN

Electron Beam (EBL)

ARP 6200

ma-N 2405

mr-POS EBR

PMMA resist
ZEP resist

 

ICP-F

SiO2
Si3N4
Silicon
TaOx
MoOx

Al2O3

Optical Lithography

AZ5214
ma-P 1210
ma-P 1420
DUV ma-N24O5

Sputter

Dielectrics

Metals

Ebeam Evaporator

All metals

P-ALD

Oxides

Nitrides

 

EBL Booking Policy

The use of the E-beam Lithography (EBL) system is quite heavy sometimes making it difficult to get a time-slot less than 1-2 weeks in advance. New rules have been formulated in order to use the system time more effectively. Please follow the following guidelines when making EBL bookings.

  1. Weekdays are separated by two 4-hour sessions per weekday, morning 09:00-13:00 and afternoon 13:00-17:00. These two time slots put a cut-off at 13:00. If you need less time, please book only that time during each time-slot. Booking longer than 4 hours should either start at 9:00 (or earlier) or 13:00 (strict). Minimum 1hr for a booking.

  2. More than one booking per user per day is NOT allowed.

  3. After 17:00 bookings are more flexible which is very feasible for longer exposure. It will be very convenient if users doing overnight bookings could start as late as possible - e.g. starting at 19:00 would give other users opportunity to extend the afternoon session for longer exposures.

  4. During weekends (Fri 18:00 - Mon 08:00) booking is fully flexible. Feel free to book any time slot of your choice.

  5. Always report a booking that cannot be used AS SOON AS POSSIBLE! Use these mail addresses to reach to ANFF staff Gayatri.Vaidya@anu.edu.au or Kaushal.Vora@anu.edu.au

Return to top