Laboratory and Equipment Resources
Please find relevant information below regarding Laboratory Safety, Tutorials, WHS documentation such as risk assessments and safe operating procdures WHS Procedures and Standard Process Recipes.
Laboratory Safety & Emergency Information
Before accessing the facilities all users must complete the induction webinar and complete the mandatory Laboratory Induction which MUST be completed and signed before access to the laboratory is granted. Please note, there will be an on-site laboratory tour to finish the induction.
It is also vital that all users familiarise themselves with the ANFF Laboratory Emergency Procedures as this document gives general information on the layout of the laboratories and associated facilities. There are also clear procedures on what to do in the event of any alarms being activated.
WHS Risk Assessments of Laboratories
The following table contains risk assessments (RA) and after-hours safe working procedures (AH_SWP) for our laboratories. Please familiarize youself and contact our process engineering staff if there are any questions.
Building | Lab | RA | AH_SWP |
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Huxley 56 | H4.30 | RA | AH SWP |
JCSMR 131 | 131_1.147 | RA | AH SWP |
Weigold 58B | W2.04 | RA | |
Weigold 58B | W2.05 | RA | AH SWP |
Weigold 58B | W2.06 | RA | AH SWP |
Carver 58C | J4.24 | RA | |
Carver 58C | J4.25 | RA | |
Nuclear 58A | A107/A201 | RA | |
#160 | P3.51 | RA | AH SWP |
Tutorials
Below are the links to tutorials covering nanofabrication techniques supported by our node. It covers introduction, theory and capapbilities of various tools.
Overview of ANFF-ACT Capabilities | Fabrication technology webinars |
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Overview of ANFF-ACT Capabilities This induction webinar outlines laboratory specific induction and authorisation requirements for the ANFF laboratories located in the Weigold Building (W2.05 and W2.06). It provides information about the inherent risks and controls established for the laboratory. New or modified tasks to be carried out in the laboratory require further formal risk assessment and subsequent approval. In addition, training will be provided for plant, equipment and safe working practices. |
Physical Vapor Deposition (PVD) Chemical Vapor Deposition (CVD) Electron Beam Lithography (EBL) Scanning Electron Microscopy with Cathodoluminescence (SEM-Cl) |
Equipment Information
The following table contains equipment specific information on risks assessments (RA), safe working procedures (SWP), instruction manuals (IM) or, for reference if required, the equipment manufacturers manuals (e.g. hardware (MH), software (MS) or general equipment manual (MM). Please familiarize youself and contact our process engineering staff if there are any questions.
RA | SWP | IM | MH | MS | |||||||
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AFM | Nanosurf | CoreAFM | Mx_Nanosurf_CoreAFM | Lily | Olivier | Kaushal | |||||
Barrel Etcher | PVA | TePla | L9_Tepla_Barrel_Etcher | Olivier | Kaushal | Gayatri | IM | ||||
Desiccator Canbinet | TerraUniversal | ValuLine Desiccator | L9_N2_desiccator_cabinet | tbd | |||||||
Diamond Sciber | OEG | MR200 | xx_Diamond_Scriber | Naiyin | RA | IM | |||||
E-beam Evaporator | Temescal | BDJ-2000 | D4_E-beam_Evap_BJD2000 | Lily | Kaushal | ||||||
EBL | Elionix | Boden 125 | EBL1_Elionix | Gayatri | Lily | Kaushal | RA | IM | |||
EBL | Raith | 150 | EBL2_Raith | Gayatri | Lily | Kaushal | IM | ||||
EDC | Laurell | WS1000 | Wx_Laurell_WS1000 | Olivier | Sukanta? | Kaushal | MH | ||||
Electroplating | CHI | 600E | xx_Electro_Plating | Lily | Kaushal | ||||||
Ellipsometer | JA Woollam | M-2000DI | M4_Woollam_Ellipsometer | Gayatri | Kaushal | IM | |||||
FIB | FEI | Helios NanoLab 600 | FIB_Helios600 | Lily | Olivier | Kaushal | IM | ||||
Flipchip Bonder | Finetech | Fineplacer Lambda | CE_Pg3_Flipchip_Finetech | Kaushal | Horst | IM | MM | MH | |||
Glovebox N2 | Scitek | Glovebox N2 | xx_Glovebox_N2_Scitek | Kaushal | |||||||
Hot Embosser | EVG | 520HE | L5_Embosser_EVG520 | Gayatri | Kaushal | IM | |||||
ICP-Cl | Samco | 400iP | P6_RIE_ICP-CL | Naiyin | Kaushal | IM | * | * | |||
ICP-F | Samco | 400iP | P5_RIE_ICP-F | Naiyin | Kaushal | IM | * | * | |||
Mask Aligner | Karl SUSS | MA6 | L2_Karl_SUSS_MA6 | Gayatri | Kaushal | ||||||
Mask Aligner | EVG | 620 | L4_NIL_Aligner_EVG620 | Gayatri | Kaushal | IM | |||||
Maskless Aligner | Heidelberg | MLA150 | L20_Heidelberg_MLA150 | Gayatri | Kaushal | RA | IM | ||||
MOCVD 1 | Aixtron | 3x2FT III-V | MOCVD1 | Mykhaylo | Naiyin | Hoe | |||||
MOCVD 2 | Aixtron | 200/4 | MOCVD2 | Mykhaylo | Naiyin | Hoe | |||||
MOCVD 3 | Aixtron | 3x2FT III-N | MOCVD3 | Mykhaylo | Naiyin | Hoe | |||||
Parylene Coater | Diener | P6 | D16_Parylene_Coater | Olivier | Naiyin | Kaushal | RA | MH | MS | ||
PECVD | Oxford Instruments | PlasmaLab 100 | P8_PECVD_Oxford100 | Naiyin | Kaushal | IM | |||||
Plasma ALD | PicoSun | Sunale | P7_P-ALD_Picosun | Naiyin | Kaushal | IM | |||||
RIE (old) | Oxford Instruments | Plasma80 | P12_RIE_Oxford80 | Naiyin | Kaushal | IM | |||||
RTA | Qualiflow Therm | JetFirst 100 | H4_RTA_JetFirst100 | Naiyin | Kaushal | IM | |||||
RTA | Jipelec | JetFirst 100 | Hx_RTA_Jipelec | Naiyin | Kaushal | ||||||
SEM-CL | FEI | Verios 460 SEM | SEM-CL_Verios460 | Olivier | Lily | IM | |||||
Spin Coater | SPS | Polos SPIN150x | Lxx_SPS_Spin_Coater | Gayatri | Kaushal | ||||||
Sputter | AJA Intl. | ATC-2400V | D3_AJA_Sputter | Olivier | Kaushal | IM | |||||
Sputter | Denton | Desk V | SEM_Denton_Sputter | Lily | IM | ||||||
Stylus Surface Profiler | Bruker | Dektak XT | M3_Bruker_Surface_Profiler | Olivier | Kaushal | ||||||
Thermal ALD | Cambridge Nano Tech | Savannah | P3_T-ALD_Savannah | Naiyin | Kaushal | ||||||
Thermal Evaporator | Kurk Lesker | Nano36 | D5_Thermal_Evap_Nano36 | Lily | Kaushal | IM | |||||
Ultrasonic Bath | Elma Trasnssonic | TI-H-15 | xx_Elma_Transsonic | ||||||||
Wetbench 1 | MicroVoid | CS-41-FRPP-9FT | WB01_Spin | Gayatri | Olivier | Kaushal | MH | ||||
Wetbench 2 | MicroVoid | CS-41-SS-6FT | WB02_Develop | Gayatri | Olivier | Kaushal | MH | ||||
Wetbench 3 | MicroVoid | CS-41-FRPP-6FT | WB03_Acid | Olivier | Gayatri | Kaushal | MH | ||||
Wetbench 4 | MicroVoid | CS-41-FRPP-6FT | WB04_Solvent | tbd | MH | ||||||
Wetbench 5 | MicroVoid | CS-41-SS-6FT | WB05_Base | tbd | MH | ||||||
Wire Bonder | Westbond | 747677E | xx_WB_Westbond | Olivier | Naiyin | Kaushal |
* Some equipment information contains manufacturers IP and is not publically available. Please contact ANFF staff to gain access to confidential information provided by the manufacturer/vendor.
Standard Process Recipes
Here is a list of typical fabricatioin process 'recipes' for a variety of tools. Please do not hesitate to consult our process engineers for advice on variations, to achieve the outcomes you require.
PEVCD |
MOCVDGaAs |
ICP-Cl |
Electron Beam (EBL)
|
ICP-F |
Optical Lithography |
Sputter |
Ebeam Evaporator |
P-ALD |
EBL Booking Policy
The use of the E-beam Lithography (EBL) system is quite heavy sometimes making it difficult to get a time-slot less than 1-2 weeks in advance. New rules have been formulated in order to use the system time more effectively. Please follow the following guidelines when making EBL bookings.
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Weekdays are separated by two 4-hour sessions per weekday, morning 09:00-13:00 and afternoon 13:00-17:00. These two time slots put a cut-off at 13:00. If you need less time, please book only that time during each time-slot. Booking longer than 4 hours should either start at 9:00 (or earlier) or 13:00 (strict). Minimum 1hr for a booking.
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More than one booking per user per day is NOT allowed.
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After 17:00 bookings are more flexible which is very feasible for longer exposure. It will be very convenient if users doing overnight bookings could start as late as possible - e.g. starting at 19:00 would give other users opportunity to extend the afternoon session for longer exposures.
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During weekends (Fri 18:00 - Mon 08:00) booking is fully flexible. Feel free to book any time slot of your choice.
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Always report a booking that cannot be used AS SOON AS POSSIBLE! Use these mail addresses to reach to ANFF staff Gayatri.Vaidya@anu.edu.au or Kaushal.Vora@anu.edu.au